DeepMind achieves 'zero global downtime' for distributed AI training

The Aptiv-owned firm joins the CHERI Alliance

Its technology is geared toward ensuring data center architectures can evolve with advancing AI models

Partners see perk reinstated as AI memory surge shows no signs of abating

New DRAM models does away with the capacitor

CAS approach helps reduce ingestion time and search latency, and enable scaling

Shanker Trivedi leaves after 17 years at the chip giant

Next-gen Rubin shipments to drop 7 points as SuperNIC and liquid cooling ‘challenges’ stack up

SEC filing confirms networking component deal, but reports suggest inference-optimized iterations of Google’s custom silicon could face delays

Pair have come a long way since their salad days of co-creating IoT starter kits

CEO details how the innovation, which shrinks free space optics into a fingernail-sized piece of hardware, could extend to data centers and space

Chipmaker follows pattern set with Wi-Fi 7 launch years ahead of IEEE standard confirmation

Alibaba and Microsoft among early adopters

Channels etched directly onto silicon remove heat 3-times better than current methods

Project to develop GaN-on-SiC-based power amplifiers

New standard aims to break vendor lock-in and lay groundwork for next-gen System-in-Package architectures

TI introduces new lidar and radar technologies to improve vehicle safety and support advanced driver assistance systems.

Applied Materials acquires 9% of BE Semiconductor Industries to bolster collaboration in hybrid bonding technology for semiconductors.

Nokia will supply ResetData with a networking backbone for new AI Factory data centers across Australia, enhancing cloud efficiency.

Integration of DownStream's solutions aims to streamline the PCB production process for Siemens EDA customers.

IBM z17 mainframe introduces enhancements for AI workloads, featuring the Telum II processor and extensive security features.

AMD has completed its acquisition of ZT Systems to enhance AI infrastructure capabilities for cloud applications.

Ayar Labs has launched the first UCIe optical interconnect chiplet, achieving 8 Tbps bandwidth to enhance AI system performance.

Mirantis announces Nebul's implementation of k0rdent for AI workloads, focusing on privacy and infrastructure unification.