Open alternative to CUDA bolstered by AI optimization for client and workstation

HPC and AI veteran joins to scale global quantum business

South Korean chip giant jumps almost 30% on Nasdaq and 13% on KRX

The satellite communications provider seeks to protect timekeeping and GPS authentication at critical sites and devices

Carina hardware platform has been delivered to Germany's DLR Quantum Computing Initiative

Partnership with fellow Entity List member marks China’s latest bid for semiconductor self-sufficiency

The largest ever listing by a foreign firm

Company worked with Broadcom and TSMC on design and manufacture of chip

FuriosaAI rejected an $800 million acquisition bid from Meta to go its own way

South Korea's xDots says its diamond NV sensor captures ultra-precise power telemetry to help AI identify energy-saving opportunities for data centers

Firms join Mediatek on low-latency demo paving the way for physical AI and industrial metaverse

VM Januscape bug unearthed after 16 years in the shadows

Millisecond coherence achieved using all-optical control in a diamond spin-photon interface

Tech giants join post-quantum race with Google and the White House as 2029 deadline looms

Research firm SemiAnalysis claims 12 months delay is due to issues manufacturing the PCB midplane

Vistara solution validates CXL standard while keeping rocketing flash prices at the door

SEMI argues that policies that “distort” pricing and capacity decisions risks prolonging downturn

Engineering lead behind AMD EPYC efforts joins custom XPU team

Yole Group report suggests AI buildout to account for more than 90% of total market revenue

Broadcom silicon powers 1.6T offering aiming to reduce network latency for AI workloads

Instances feature boosted performance and secure isolation for intensive workloads

The short-lived rise and fall of Equinix Metal

Price hikes for GPU reservation service jump for the second time in just six months

Former SpaceX engineers' startup set to scale 1.6T AI interconnects with ‘fast and repeatable flip chip die bonding’