Iridium launches resilient GNSS PNT ASIC commercially
The satellite communications provider seeks to protect timekeeping and GPS authentication at critical sites and devices
The satellite communications provider seeks to protect timekeeping and GPS authentication at critical sites and devices
Carina hardware platform has been delivered to Germany's DLR Quantum Computing Initiative
First-ever cloud AI infrastructure report pits hyperscale giants against agile, purpose-built neocloud alternatives
Partnership with fellow Entity List member marks China’s latest bid for semiconductor self-sufficiency
The largest ever listing by a foreign firm
Company worked with Broadcom and TSMC on design and manufacture of chip
Cell-based load balancing and deep-buffer interconnect used to reduce congestion caused by AI traffic bursts
FuriosaAI rejected an $800 million acquisition bid from Meta to go its own way
Version 4.0 of its flagship platform sees software-defined vendor seek to maximize value of existing storage infrastructure
Research firm SemiAnalysis claims 12 months delay is due to issues manufacturing the PCB midplane
Vistara solution validates CXL standard while keeping rocketing flash prices at the door
DoCoMo arm tethers Japan's regional hubs through IOWN-APN
SEMI argues that policies that “distort” pricing and capacity decisions risks prolonging downturn
AMS-Osram, known for auto lighting, taps Ashkan Seyedi to lead new optical interconnect business
The integration ties AT&T’s network into AWS Interconnect service
Engineering lead behind AMD EPYC efforts joins custom XPU team
ZR/ZR+-based modules support transmissions up to 310 miles
Yole Group report suggests AI buildout to account for more than 90% of total market revenue
Broadcom silicon powers 1.6T offering aiming to reduce network latency for AI workloads
Instances feature boosted performance and secure isolation for intensive workloads
Price hikes for GPU reservation service jump for the second time in just six months
Former SpaceX engineers' startup set to scale 1.6T AI interconnects with ‘fast and repeatable flip chip die bonding’
Update introduces hardware-level MAC learning and expanded storage management to ensure end-to-end data separation
Open source giant brought in to optimize RISC-V hardware for sovereign enterprise deployments