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The latest news on networking, cloud, and AI infrastructure

02 Jul 2026

DriveNets unveils high-capacity AI fabric platforms to connect thousands of XPUs

Broadcom silicon powers 1.6T offering aiming to reduce network latency for AI workloads

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  01 May 2026

  Nvidia seeks materials engineer as its networking ambitions generate heat in more ways than one

• HPE earnings sees Juniper bring the green on all fronts

  05 Dec 2025

• HPE's GX5000 supercomputing reveal signals shift toward flexible infrastructure

  27 Oct 2025

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  24 Sep 2025

  Microsoft uses microfluidics to cool chips from the inside

  Channels etched directly onto silicon remove heat 3-times better than current methods