Qualcomm-backed Lumilens debuts at a $5.5 billion valuation, with a mystery hyperscale customer already on board

Multi-year purchase commitments triple as Arista tightens supply to push further into non-Nvidia accelerator networking

Cloud giant’s reliance on Chinese optics could be hampered by national security concerns, per Reuters

Thiel Foundation fellow-led startup entices Nicira, Barefoot Networks co-founder to lend networking expertise

Fidelity, Intel back Xsight to scale its programmable, AI-focused DPUs and switch silicon

CEO Wendell Weeks sees exponential adoption for co-packaged optics in AI infrastructure across scale-up and scale-out networking

Jensen Huang darling and AI optics ‘company to beat’ to further tap Indian talent pool

Network giant touts potential of OpenAI’s distributed AI training transport

Sovereignty-centric team up to challenge non-European AI networking dominance

Scale-up interconnects emerge as a multihundred-billion-dollar market category

Featuring programmable 400G DPUs and a single-hop fabric, Helios targets a streamlined, open-standards approach to rival NVL72

Microsoft and SpaceXAI join neoclouds among early users

Gartner server CPU gong goes to AMD while Marvell outclasses on optical connectivity

Hyperscale wants photonics boffins to wire up its AI infrastructure with light

Partnership to reduce data center deployment times … and dust

Carina hardware platform has been delivered to Germany's DLR Quantum Computing Initiative

Cell-based load balancing and deep-buffer interconnect used to reduce congestion caused by AI traffic bursts

Research firm SemiAnalysis claims 12 months delay is due to issues manufacturing the PCB midplane

AMS-Osram, known for auto lighting, taps Ashkan Seyedi to lead new optical interconnect business

The integration ties AT&T’s network into AWS Interconnect service

ZR/ZR+-based modules support transmissions up to 310 miles

Yole Group report suggests AI buildout to account for more than 90% of total market revenue

Broadcom silicon powers 1.6T offering aiming to reduce network latency for AI workloads

Former SpaceX engineers' startup set to scale 1.6T AI interconnects with ‘fast and repeatable flip chip die bonding’