Samsung could spend north of $10 billion to bring its semiconductor manufacturing capabilities to the U.S., Bloomberg reported Friday.

The semiconductor giant is reportedly investigating building a chip fabrication facility in Austin, Texas, capable of producing silicon wafers based on the company’s forthcoming 3-nanometer manufacturing process.

Bloomberg reports, that while the plans are still in the preliminary stages, Samsung is looking to begin construction later this year and complete the project as early as 2023. The facility would be the first in the U.S. to use extreme-ultraviolet lithography, Bloomberg reports.

In recent months, the U.S. government has pushed to secure U.S. semiconductor supply chains and taken efforts to cut off companies with ties to China’s military from U.S.-owned intellectual property. The latest of these efforts included cutting off Huawei from U.S.-made processors, including those from Intel.

These efforts also included moves to woo semiconductor manufacturers like Taiwan Semiconductor Manufacturing Co. (TSMC) and Intel to build new chip fabs in the U.S. However, it remains to be seen whether the Biden administration will continue these efforts. President Joe Biden’s rhetoric during his campaign suggest he might.

The Samsung news comes months after TSMC announced plans to build a $12 billion semiconductor fab in Arizona. The relatively small facility is expected to produce 20,000 silicon wafers per month using the company’s 5-nanometer manufacturing process. The facility, which will be built in a yet-to-be-disclosed location in Arizona, will employ north of 1,600 people, TSMC claimed in May.

TSMC plans to begin construction on the facility later this year with a completion date targeted for some time in 2024.

Bringing manufacturing the U.S. could ultimately benefit both companies given the potential for Intel to begin outsourcing a broader array of its product line to external fabs. Intel already outsources some of its product line, including its new data center GPU.

Earlier this month, Intel entered into talks with both Samsung and TSMC about the possibility of producing its flagship processors, according to an earlier report from Bloomberg.

During Intel’s forth quarter 2020 earnings call Thursday, incoming CEO Pat Gelsinger expressed confidence that the company’s next generation of CPUs would be based on its internally developed 7-nanometer process, but left the door open to external fabs. He said the decision to move forward with the company’s 7-nanometer process is far from final.

“Given the breadth of our portfolio, it’s likely that we will expand our use of external foundries for certain technologies and products,” the outgoing VMware CEO added.

Intel is expected to provide additional details on its 2023 roadmap later this year, after Gelsinger can fully assess the situation.