Nvidia is contributing its Vera Rubin rack and tray designs to the Open Compute Project (OCP), a move it claims will foster open standards.

Included in the tech giant’s infra gift are cable-and fan-free liquid-cooled compute trays, interoperable rack-scale interconnect infrastructure, and a liquid-cooled 5,000 amp busbar built for higher-power systems.

The Vera Rubin update ties to version 1.2 of its modular reference design standard, MGX. Opening up its infrastructure designs is not a new thing for Nvidia; it previously did the same with Blackwell. The standardization move lets manufacturers build around its platform, while keeping its compute hardware directly intertwined and therefore the center of attention.

This latest effort doubles down on liquid cooling, featuring connector solutions for inside trays that allow for cold plates to be swapped out more easily without any unwanted spillage. The MGX 1.2 spec also adds native 19-inch equipment support and higher-density rack designs, and supports rack deployments of up to 250 kilowatts.

“The bottleneck for AI factory buildouts is how fast we can manufacture and deploy,” Joe DeLaere, Nvidia’s product lead for AI infrastructure solutions, said during a press briefing. “So when the specification is open, the equipment makers and component developers can start fabricating right away and build a supply chain instead of waiting for a singular customer with one proprietary spec. So overall, that accelerates the entire industry. The ecosystem grows, and we grow with them.”

A separate spec extends the MGX beyond GPUs to cover the new Vera CPU rack, which Nvidia revealed has started shipping.