Innovium raised $38.3 million in a Series C round, and the company also introduced a family of Ethernet switch chips that range from 3.2 Tb/s to 12.8 Tb/s, designed specifically for use in data centers.

The top-end product would roughly double the speed of the fastest such product announced thus far. Barefoot Networks last summer announced an Ethernet switch that runs at 6.5 Tb/s (which happened to have doubled the speed of the previous record holder, from Cavium).

Barefoot recently said its chips will appear in white box switches from Edgecore and Wistron NeWeb Corp. (WNC) soon, possibly later this quarter. Edgecore is also working with Cavium.

Data centers are a glamor application for Ethernet switches, and several of the biggest companies in the world are maneuvering in ways guaranteed to produce a clash of titans for market share. Broadcom has been the dominant supplier thus far. Meanwhile, Qualcomm is an investor in Innovium, whose founders include some ex-Broadcom execs. And Google has put money into Barefoot.

Innovium’s new switch line, named Teralynx, includes support for 10/25/40/50/100/200/400 Gb/s Ethernet standards. The company claims a series of other firsts: the first to feature 128 ports of 100 Gb/s Ethernet, 64 ports of 200 Gb/s Ethernet or 32 ports of 400 Gb/s Ethernet in a single device. When it comes to performance, the company claims to have the industry’s best throughput, telemetry, buffer size, programmability, and power efficiency for data centers.

Teralynx hardware design collateral and software development kits are available now for certain customers, the company said. Actual silicon will sample in the third quarter, along with evaluation systems.

On top of the product introduction, Innovium also announced a reference design solution that combines Innovium’s 12.8 Tb/s Ethernet switch silicon with Inphi’s 4-level PAM4 (pulse amplitude modulation) chipset. This solution combines 100G optics and copper connectivity, which Innovium says will reduce complexity, power, latency, and cost, while gaining superior performance, analytics and programmability compared to solutions using multiple 3.2 Tb/s or 6.4 Tb/s switch chips.

Participants in Innovium’s most recent round were mostly straight-up investment firms, but as in previous rounds, Qualcomm’s venture capital arm was involved.

Innovium’s Series C investors included new investor Redline Capital, along with previous investors Greylock Partners, Walden Riverwood Ventures, Capricorn Investment Group, Qualcomm Ventures, and S-Cubed Capital.

The new funding round brings Innovium’s total financing to $90 million and will be used to accelerate commercialization of the Teralynx product family, the company said.