Texas Instruments has introduced new power-management chips aimed at addressing the growing power demands of modern data centers driven by high-performance computing (HPC) and artificial intelligence (AI). The notable offerings include the TPS1685, the first 48V integrated hot-swap eFuse with power-path protection, and a new series of integrated gallium nitride (GaN) power stages utilizing standard TOLL packaging. These advancements are designed to help data center designers streamline their systems while enhancing efficiency and scalability.

With increased power requirements as data centers adopt more powerful hardware, the TPS1685 enables operation at over 6kW. This integrated solution also reduces system size by half compared to traditional designs. Additionally, the new GaN power stages are optimized for high efficiency and density, achieving significant performance while incorporating necessary protection features.

Robert Taylor, general manager of Industrial Power Design Services at Texas Instruments, stated, “As data centers increasingly demand more energy, powering the world's digital infrastructure begins with smarter, more efficient semiconductors.” He noted that these chips support both the escalating computational needs of AI and the need for reduced energy consumption.

Texas Instruments is showcasing these solutions at the 2025 Applied Power Electronics Conference from March 16-20 in Atlanta. The company anticipates that its innovations will allow for greater flexibility and lower environmental impact in data center operations.

The new chips are now available for purchase, with various options for evaluation modules. For more information on the TPS1685 and GaN power stages, interested parties can visit Texas Instruments' official website.