SK hynix has shipped samples of its 12-layer HBM4, a new ultra-high performance DRAM product for Artificial Intelligence, to major customers ahead of schedule. The company plans to begin mass production in the second half of 2025, following the necessary certification process.

The samples, which showcase industry-leading capacity and speed crucial for AI applications, were delivered based on SK hynix's extensive production and technological expertise in the HBM market. The 12-layer HBM4 boasts bandwidth capable of processing more than 2TB of data per second, a significant increase over the previous generation HBM3E.

The new product achieves a capacity of 36GB using the Advanced MR-MUF process, which also enhances product stability by improving heat dissipation. SK hynix has maintained its position in the AI memory sector after being the first to mass produce HBM3 in 2022 and subsequently HBM3E in 2024.

Justin Kim, President & Head of AI Infra at SK hynix, noted, “We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands.