Laser Photonics Corporation is expanding its Laser Wafer Marking technology research and development program to better support the growth of chip manufacturing in the U.S. The announcement comes in collaboration with its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser).

The advanced laser marking technologies are specifically tailored for engraving serial numbers and critical information on silicon and other materials used in the semiconductor industry. “By integrating CMS Laser’s expertise with our advanced R&D initiatives, we are committed to providing chip manufacturers with the most sophisticated laser wafer processing systems,” said John Armstrong, Executive Vice President of LPC. This venture is in response to increasing demands for chips and regulatory support in the sector.

CMS Laser's laser marking technology offers customizable solutions, including various configurations for laser types, product transport, machine vision, and fume extraction, allowing for precise integration into existing manufacturing environments. Chip manufacturers are expected to benefit from increased production efficiency and uniformity, enhancing competitiveness in the market.

Through this R&D investment, LPC aims to strengthen its positioning in the semiconductor industry, addressing the urgent demand for advanced manufacturing technologies and boosting shareholder value.