Laser Photonics Corporation (LPC) announced its attendance at the International Electron Devices Meeting (IEDM) 2024 to showcase advanced laser systems tailored for the semiconductor industry.

IEDM 2024, organized by the IEEE and the Electron Devices Society, will serve as the primary global platform for advancements in semiconductor and electronic device technology. The event will occur December 7-11, 2024, at the Hilton San Francisco, where LPC will be located at Booth 3 in the Yosemite Ballroom.

Wayne Tupuola, CEO of LPC, said, “For Laser Photonics, IEDM is an excellent platform to present our state-of-the-art solutions for dicing and marking of silicon, sapphire and compounds.” Tupuola expressed eagerness to demonstrate how laser technology can effectively process sensitive materials used in semiconductors and solar panels.

At IEDM 2024, visitors can explore LPC’s BlackStar Laser Wafer Dicer, designed for optimal die singulation, and the High-Precision Wafer Serialization, Marking and Scribing laser system for enhanced traceability. Also featured will be the Laser Marking of Integrated Circuit (IC) Mold Compounds, which boasts high-speed fiducial recognition for safely marking small components.

Laser Photonics, known for its innovative laser technologies, focuses on improving surface cleaning, rust removal, and other industrial applications. The company aims to redefine processes traditionally reliant on sandblasting, positioning itself as a leader in laser systems across multiple industries.

The 70th Annual IEDM will bring together industry leaders, engineers, and scientists to exchange insights on the latest developments in semiconductor technology.