CoolIT Systems has announced a new single-phase direct liquid cooling (DLC) coldplate designed to handle 4000W, significantly exceeding the previous cooling capabilities for this technology. This development is notable in the context of demands for cooling solutions in artificial intelligence (AI) and high-performance computing (HPC) sectors.

“CoolIT continues to lead the industry in performance. We are thrilled to show silicon leaders that single-phase DLC will continue to be a key enabling technology with demonstrated capability for up to 4000W processors,” stated Kamal Mostafavi, VP of Engineering. He also noted the reliability and scalability of this cooling method for high-wattage microprocessors.

The new coldplate utilizes water or a water-glycol mixture to remove heat from chips effectively and has been shown to capture over 97% of the heat from a thermal test vehicle with a flow rate of 6 liters per minute. CoolIT's design achieves a low thermal resistance of 0.009 C/W while maintaining an efficient flow loop pressure drop.

Relevant for numerous server generations, the coldplate’s Split-Flow™ technology improves thermal and flow performance by 30% compared to standard coldplates, facilitating targeted cooling to hot spots. These advancements affirm CoolIT's position in providing effective cooling solutions for high-demand semiconductor applications.

For further details and technical specifications, additional information is available on the CoolIT Systems website.