
Samsung’s advanced chip packaging VP Lin Jun-Cheng leaves company
Ex-TSMC executive departs Samsung as contract comes to an end
Ex-TSMC executive departs Samsung as contract comes to an end
Will support the three companies' planned investments across Texas, Utah, and Arizona
Former CEO Pat Gelsinger amongst executives named in the case
Plus a roundup of some other recent chip funding news
System will be housed at the company’s IIM-1 fab in Hokkaido
SMART USA Institute aims to advance semiconductor manufacturing with digital twin technology
Acquired double the Nvidia chips as Meta, according to Omdia
One of 27 centers expected to be established by the European Commission
Fifth company to finalize funding agreement
Plus a round up of other recent supercomputing news
Will be deployed by the end of 2026
Codenamed Baltra, the chips are expected to be mass-produced by 2026
Will allow up to 1,000 accelerators to be connected together as one cluster
Plus a roundup of other quantum computing news
Fourth company to finalize negotiations with Department of Commerce
Comes after chipmaker finalized CHIPS and Science Act funding
Three-pronged strategy comes with CA$2bn investment pledge
Will be coupled with JURECA DC supercomputer at Germany’s Jülich Supercomputing Centre
Company valued at $2.6bn
Plus a roundup of other supercomputing news
Will use funding to grow its workforce and further develop its forthcoming photonics processor
First phase of planned £1bn cash injection
Machine will be installed in Q1 2025
Two interim CEOs have been appointed until a replacement is found