
Department of Commerce proposes $6.7m in CHIPS funding for MEMS manufacturer Rogue Valley Microdevices
Department has signed a non-binding preliminary memorandum of terms with the company
Department has signed a non-binding preliminary memorandum of terms with the company
Team of Tagore engineers will join the company
Developed by researchers at Tianjin University and the Southern University of Science and Technology
Further extends program launched by department in 2023
Jean-Didier Allegrucci joins company as head of hardware engineering
Brings company’s total funding to $4.5m
Left Nvidia last month after almost seven years
Negotiations over pay and benefits have once again broken down
Company spun out of the Delft University of Technology in 2018
Brings total raised by the company to $120m
High-bandwidth memory critical component of AI chips
Company also looking to streamline its growing list of subsidiaries
Deal expected to close in 2025
Company moving to liquid cooling for high-density chips
Company claims its algorithm-specific chips are significantly faster than Nvidia’s upcoming Blackwell offering
Project aims to advance quantum networking capabilities
Worst case scenario under current plans would see industry emissions exceed 100 megatons by 2030
Company with granted approval for the development this week
Company has raised $120 million to date
Cluster replaces end-of-life system in UK
No vendor for the system has been named
Testing process for incoming chips for complicated than previous generations
Advanced AI processors will be manufactured by TSMC
Financial terms of the deal were not disclosed