
India and Singapore sign MoU to boost semiconductor collaboration
Two countries also agreed to collaborate on digital technologies and skills
Two countries also agreed to collaborate on digital technologies and skills
Chipmaker Broadcom reportedly unsatisfied with results of Intel’s 18A manufacturing process
Includes reducing trade restrictions and increasing the sector’s skilled workforce
Will be used to advance climate modeling
Diamond quantum accelerators will be integrated with classical HPC systems
Will help to develop substrates, device layers, and junctions
Process node not slated for mass production until late 2026
Could include proposal to shed Altera chip unit or shelve German chip fab
Partnership set to “drive greater utilization” of companies’ respective GPU clusters
Five new systems will be housed at the company’s development and innovation center in Rio de Janeiro
Claims cloud-based supercomputers will have 160 exaflops of performance
Prime Minister Dick Schoof unlikely to renew licenses when they expire at the end of the year
First cloud service provider to adopt Gaudi 3
Will provide four times the performance of predecessor
CFO Colette Kress told analysts Blackwell demand is outpacing supply
However, terms and conditions do apply
Price of minerals has nearly doubled since sanctions came into force
Facility expected to be operational in 2027
Chipmaker also looking to fend off potential activist campaign from investors
Follows an investment round in May
Company planning to invest $18bn across the two states
Japanese conglomerate wants to enter the AI chip space
Sales comes weeks after Intel posted Q2 2024 financial woes
Offerings now available for licensing