Broadcom expands 'Wi-Fi 8-ready' silicon line with APU and switch
New BCM49438 APU and Trident X3+ switch target enterprise edge AI and high-density Wi-Fi 8 deployments – despite the final standard being years away
New BCM49438 APU and Trident X3+ switch target enterprise edge AI and high-density Wi-Fi 8 deployments – despite the final standard being years away
Technology will support AI infrastructure demands, with prototypes expected to be available in 2027
Fabless chip designer bets big on optical interconnects to boost data center capabilities
The new addition is also said to improve workloads with storage and security features
Solidigm repivoted as Korean giant double dips on AI once more, this time in the U.S.
Price tag of its China independence also revealed
Hyperscaler leverages a two-tier Ethernet-based topology, custom AI Transport Layer & software tools to deliver a tightly integrated, low-latency platform
Tech giant wants to make emerging quantum programming workflows ‘faster and easier’
HBM4 win for Korean giant as it finds parity with SK Hynix
System is first Intel Xeon 6 cluster to use immersion cooling
Bain & Company research reveals a massive gap between executive awareness and action on quantum security
Upscale AI wants open protocols like UALlink and Ultra Ethernet to power its SkyHammer line
Investment giant targets operational burdens with software-defined Infrinia AI stack
Untangling the consequences of the quantum world
First RISC-V company to partner with Nvidia on the interconnect technology
Huawei and ZTE under threat as EU emboldens security, as European AI gigafactories take a step closer to reality
'Conditional memory' concept moves simple lookups from expensive GPU memory to cheaper CPU RAM
House China committee argues new laws don't go far enough
Seeking proposals to scale up circuits for transceivers, accelerators, and other chip types
Wi-Fi weak spot linked to Broadcom chips
RCE flaw could put critical infrastructure at risk
Next-gen Rubin platform will see DPUs help control all network I/O to and from the compute node
First memory chips. Then lasers. Now, copper looks to be the next commodity to pose ‘systemic risk’ to the digital infrastructure space
Firms prepare for agentic avalanche