Register for: 24th International Symposium on High Performance Interconnects HotI 2016 on August 24-26, 2016 produced by IEEE!
Why you can’t miss the 24th International Symposium on High Performance Interconnects HotI 2016 on August 24 – 26, 2016:
Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multicore on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.
Themes include crosscutting issues spanning computer systems, networking technologies, and communication protocols for high performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading edge products and their performance evaluation. Additional topics of interest are listed below.
This year’s best papers on interconnect micro-architecture will be invited to submit extended versions of their papers to a special edition of IEEE Micro.
Building on last year’s successful technical program, keynotes, sessions, and panels on datacenter networking, requirements, and solutions, in 2016 Hot Interconnects will be held at the Huawei North America Headquarters in Santa Clara, CA. This year’s conference focuses on data center, virtualized, and cloud networking. We hope you can join us there.
Topics of Interest:
* Novel and innovative interconnect architectures
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Survivability and fault-tolerance of interconnects
* High-speed packet processing engines and network processors
* High- performance host-network interface architectures
* High bandwidth and low latency I/O
* Software for Network/Fabric Bring up, Configuration and Performance Management, e.g., OpenFlow or OpenSM
Learn more about the event organizer: IEEE
For more information on the August 24 – 26, 2016 24th International Symposium on High Performance Interconnects HotI 2016, visit the Hot Interconnects website.