Intel continued its foundry services spending spree today with a $7 billion packaging facility in Malaysia, Bloomberg reports.

Intel CEO Pat Gelsinger, joined by Malaysia’s Trade Minister Azmin Ali and Investment Development Authority CEO Arham Abdul, will discuss the expansion in detail during a press conference at the Kuala Lumpur International Airport on Wednesday, according to a press invite obtained by Bloomberg.

The facility marks the latest in a series of multi-billion dollar fabrication and packaging facilities which Intel says will enable it to compete with rival foundry operators Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung on the global stage.

Since taking the helm late last winter, Gelsinger has moved quickly to mold Intel to his vision. Barely a month into his tenure, Gelsinger opened Intel’s chip fabs to contract manufacturing under the newly formed Intel Foundry Services (IFS) business unit.

The announcement came alongside a $20 billion foundry expansion that would see two leading-edge chip fabs constructed on the company’s Ocotillo campus. Intel broke ground on the facilities this fall.

The chipmaker also earmarked $3.5 billion to modernize its historic Rio Rancho, New Mexico fab to produce chips based on the company’s Foveros package technology.

Meanwhile, Intel is actively investigating an expansion in the European market where it expects to invest as much as $95 billion over the next decade. For the moment, the chipmaker has its sights set on adding two foundries in the region pending financial support from European leaders.